个人简介
陆向宁，博士，教授，机械工程、电子信息专业硕士生导师，江苏省高校“青蓝工程”中青年学术带头人，江苏省双创博士—“科技副总”。主持国家自然科学基金3项、江苏省高校自然科学基金1项，主持徐州市科技成果转化项目1项；获得淮海科技二等奖 1项，徐州国际英才创业大赛三等奖1项；发表高水平学术论文60余篇，撰写学术专著1部，获得授权专利3项，并全部转化。
研究方向
▪微电子封装工艺及可靠性分析，微纳传感与制造，机器视觉。
主讲课程
1.本科生课程：《微机原理》《单片机原理与应用》
2.研究生课程：《MATLAB及其工程应用》《微机电系统》
论文专著及专利
1.Wang H., Chen T., Peng J., Sheng L., Ye G., He Z., Lu X., A Novel Annular-Dielectric-Layer-Structured TSV in Silicon Interposer for 2.5D/3D Integration[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology. 2026
2.Zhou, J., Shao, Y., Song, X., Chen, T., & Lu, X., High-performance polydopamine and silver nanoparticle-modified MXene-based hydrogel flexible strain sensors for transfer-learning-assisted handwriting recognition and wrist-movement monitoring[J]. Nanoscale. 2026, 18, 2558-2573.
3.Yuan, J., He, Z., Xu, L., Peng, J., Gutierrez, H., Sheng, L., Chen, T. and Lu, X., An overview of infrared thermography for inspection of solder joint in electronic devices[J]. Infrared Physics & Technology, 2026,155:106508.
4.Wu Z., Dai Z., Ye G., Peng J., He Z., Lu X., Thermal analysis of a novel fan-out packaging structure optimized with graphene[J]. Engineering Research Express. 2025,7(2): 025579
5.Wu Z., Ye G., Peng J., He Z., Lu X.. Embedded microneedle fin chip heat dissipation design and simulation[J]. European Physical Journal Plus,2025,140:685.
6.Xu L., Peng J., Liu P., Sheng L., Lu X., He Z., An improved detection algorithm using RFS-YOLOv8n for wafer surface defect[J]. Measurement Science and Technology,2025,36(7):075401.
7.Lu, X., Wang, Z., He, Z., Liao, G. and Shi, T., Multi-scale coefficients fusion strategy for enhancement of SAM image in solder joints detection[J]. Journal of Nondestructive Evaluation, 2024, 43(1):6.
8.Zhu G., Peng J., Sheng L., Chen T., He Z., Lu X.. Optimized YOLOv8 based on SGW for surface defect detection of silicon wafer[J]. Physica Scripta, 2024,99(12):126006.
9.Lu, X., He, Z., Gutierrez, H., Liao, G., Shi, T. Intelligent diagnosis of flip chip solder joints with resolution enhanced SAM image[J]. ISA transactions, 2023, 138:603-610.
10.Zhou, J., Chen, T., He, Z., Lu, X. High-Sensitivity Pressure Sensors Using PPy/MWCNTs/PDMS@ Melamine Foam for Human Motion Detection on Land and Underwater. ACS Applied Electronic Materials, 2023, 5:3925-3937.
11.Zhou, J., Chen, T., He, Z., Sheng, L. and Lu, X., Stretchable, ultralow detection limit and anti-interference hydrogel strain sensor for intelligent throat speech recognition using Resnet50 neural network[J]. Journal of Materials Chemistry C, 2023,11(39):13476-13487.
12.Sha, Y., He, Z., Gutierrez, H., Du, J., Yang, W., Lu, X. Small sample classification based on data enhancement and its application in flip chip defection. Microelectronics Reliability, 2023, 141, 114887.
13.陆向宁, 刘凡, 何贞志等. 稀疏重构SAM芯片焊点检测方法研究[J]. 机械工程学报, 2023, 59(06): 95-102.
14.Huang, J., He, Z., Gutierrez, H., Zhao, L., Lu, X. Heat Dissipation Derivation and Optimization of the Fan-Out 3-D Package Model. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2021, 11(9), 1461-1470.
15.Huang, J., He, Z., Li, C., Zhao, L., Lu, X. Heat dissipation optimization and prediction for three-dimensional fan-out package. International Journal of Thermal Sciences, 2021, 166, 106983.
16.Wang, W., Lu, X., He, Z., Shi, T. Using convolutional neural network for intelligent SAM inspection of flip chips. Measurement Science and Technology, 2021, 32(11), 115022.
17.Zhao, L., He, Z., Wang, Z., Su, L., Lu, X. Simulation and experimental investigation on active thermography test of the solder balls. IEEE Transactions on Industrial Informatics, 2020, 16(3), 1617-1624.
18.陆向宁，主动红外微电子封装缺陷检测技术，电子工业出版社，2016.12.20，专著
科研项目
1.扇出先进封装复合RDLs制备工艺及性能研究，国家自然科学基金面上项目，2021.1-2024.12，主持
2.基于石墨烯/Cu的密集硅通孔结构制备和性能调控，国家自然科学基金面上项目，2017.1-2020.12，主持
3.面向三维集成的TSV填充缺陷检测方法研究，国家自然科学基金青年基金，2014.1-2016.12，主持
4.大功率引脚透锡深度检测算法开发，企业横向项目，2024.5-2024.11，主要参与人
5.晶圆切割缺陷智能视觉检测系统开发，企业横向项目，2022.1-2022.12，主持
